wire bonding

Wire bonding is still the most popular interconnect technology in the first-level packaging.

一级封装中最流行的互连技术仍为丝焊.

The methods of3D interconnection can be classified into the wire bonding, flip chip, through silicon via ( TSV) and film wire technology, whose advantages and disadvantages are analyzed.

将实现3D互连的方法分为引线键合、倒装芯片、硅通孔、薄膜导线等，并对它们的优缺点进行了分析。

Transient Temperature Property of Ultrasonic Wire Bonding Process

超声引线键合过程的瞬态温度特性

The vibration simulation model of a transducer system in thermosonic wire bonding was established by finite element method and verified by electrical sine sweeping exciting experiment.

在建立热超声引线键合换能系统各子部分运动方程的基础上，利用有限元方法建立空载情况下换能系统的振动特性仿真模型，并采用正弦扫频方法验证仿真模型。

In this circumstances, we work with K & S company to develop the computerized wire bonding system.

在这种情况下我们公司和K & S公司合作开发了计算机辅助焊线系统.

Analysis of Copper Wire Bonding Capability in Chip Packaging

芯片封装中铜线焊接性能分析

The thermocompression wire bonding strength was tested with bonding tester. The strength was over 0.17 N.

使用接合强度测试仪对压焊键合点强度进行了拉断试验，测得键合强度拉断力都在0.17N之上。

The content and focus of the project is based on the research and analysis of the present condition of internal and external golden bonding wire production.

我们在对国内外的键合金丝生产及研究现状进行详细分析与研究之后，确立了项目的研究内容并提出了项目的预期目标。

Ultra-fine-pitch wire bonding may make some parameters to their physics extreme, require the free air ball and bonded ball of smaller diameter and the diameter of gold line adopted.

超细间距引线键合将部分参数推向其物理极限值，要求更小直径的金球（Free Air Ball）和键合球（bonded ball），所采用的金线直径更小。

Simulation Study of Wire Loop Profiling in IC Wire bonding

IC引线键合引线轮廓成形仿真研究

The thermoageing failure mechanism after aluminium wire bonding of this gold conductor and function of added alloy are discussed.

在金浆中添加了少量合金元素，并选用混合型粘结剂。

Through the track of anti-oxidation, make rail temperature 40 ° c and no oxidation, improve the wire bonding ability.

通过轨道的防氧化改造，使轨道温度升高40℃也没有发生氧化，提高了铜丝键合能力。

A Novel Instrument of Thermocompression Wire Bonding

一种硅芯片外引线键合的热压焊简易装置

The microelectronics packaging technology is developed to be thinner and smaller with the new technique of stacked chip package, while it also brings the challenge of low-loop for the thermosonic wire bonding process.

叠层封装技术满足了微电子封装向轻薄小发展的趋势，同时热超声键合技术的低弧大跨度带来了新的挑战。

The parameters of FAB ( free air ball) process during copper wire bonding were optimized.

对铜丝球键合焊形球过程FAB参数进行了优化。

"Rubber, vulcanized Determination of adhesion to single wire Pull out test" Gullibility: Measure of speed of paper adhesive bonding and its strength.

GB/T3513-1983橡胶与单根钢丝粘合强度的测定抽出法胶粘性能：胶粘剂对纸品的粘合速度和强度的能力。

The Optimization Design of Wire Bonding Force Control System

引线键合力控制系统的优化设计

The automatic position alignment system for the ultrasonic wire bonding machine

超声压焊机自动位置对准系统

This paper simply described the process inspection of automation Al wire ultrasonic wedge bonding in ceramic packaging IC.

本文简要描述了陶瓷外壳封装集成电路自动铝丝楔焊键合的工序检查。

Set up an ultrasonic wire bonding laboratory.

成立超声波电子焊接实验室.

The first step is to model the close loop control system of wire bonding force.

两步走的策略被采用：第一步，建立键合力控制系统的闭环模型；

From the view of wire bonding, the whole procedure consists of two states: the free motion and the constrained motion.

从引线键合运动的角度来说，完整过程包括两种不同的运动状态：自由运动和约束运动。

Design of welding pressure control system for ultrasonic gold wire bonding machine

超声波金丝球焊线机焊接压力控制系统设计

Set up ultrasonic wire bonding laboratory.

成立超声波电子焊接实验室。

The results from encapsulation peel tests, die and encapsulant pull tests, bonding wire pull tests and C-Mode SAM ( C-SAM) examination are presented. This paper demonstrates that the optimized plasma cleaning process would enhance PBGA package qualification level and improve the process yields and productivity.

陈述了密封剥离试验、芯片和密封剂拉力试验、焊线拉力试验和C-模式SAM（C-SAM）检查的结果，证明了最佳的等离子清洗工艺会增强PBGA封装的定性等级，并提高工艺效率和生产率。

Ultrasonic wire bonding is one of the most important technologies in chip interconnection of integrated circuits.

超声键合是实现集成电路封装中芯片互连的关键技术之一.

To improve the speed and accuracy of automatic frequency tracking on thermosonic wire bonding, the design scheme based on FPGA was proposed.

为进一步提高热超声引线键合超声电源的自动频率跟踪速度及精度，提出了基于现场可编程门阵列（FPGA）的超声电源设计方案。

Development of Control System Used in Ultrasonic Al Wire Bonding Machine

超声波铝线自动邦定机控制系统的研制

Considering these factors, the flowing two parts should be considered in the wire bonding process: Free air ball formation and Looping stability.

对应于这些参数在焊线机制程的关键技术，可分为金线结球及焊线路径稳定性两个部分。

In piezoresistive pressure sensor packaging process, the thermocompression wire bonding was studied to meet the outer interconnection of silicon gauge.

为满足压阻式压力传感器封装工艺中硅芯片外引线键合的要求，研制了热压焊简易装置；